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ANISOTROPIC CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME

There are provided an anisotropic conductive film, a method of manufacturing the same, and a printed circuit board using the same. More specifically, the anisotropic conductive film according to an exemplary embodiment of the present disclosure includes an insulating mattress containing a non-conductive polymer, and a plurality of conductive cylinders formed in a direction from an upper surface to a lower surface of the insulating mattress, containing a conductive polymer. Further, the printed circuit board using the anisotropic conductive film of the present disclosure may prevent open or short between upper circuit patterns and lower circuit patterns, and allow a fine pitch between the circuit patterns, due to the structure of the anisotropic conductive film formed between the substrates.


» Number: US2016100481A1 (A1)

» Publication Date: 06/04/2016

» Applicant: SAMSUNG ELECTRO MECH?[KR]

» Inventor: KIM YOUNG SOON?[KR]

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This project has received funding from the European Union’s Horizon 2020 research and innovation program under grant agreement N° 690103